Minimizationof wirelength in 3d IC routing by using differential evolution algorithm

K. Pandiaraj, P. Sivakumar, R. Sridevi
{"title":"Minimizationof wirelength in 3d IC routing by using differential evolution algorithm","authors":"K. Pandiaraj, P. Sivakumar, R. Sridevi","doi":"10.1109/ICEICE.2017.8191950","DOIUrl":null,"url":null,"abstract":"The wire-length of vertically stacked ICs plays a vital role. The wire-length is minimized by using differential evolutionary algorithms withIBM Benchmark inputs. Moreover this wire length is minimized with the respect to the length of the Through Silicon via (TSVs). As a result, the wire-length has been minimized using this algorithm with various parameters. Experimental result shows that the total wirelength can be reduced.","PeriodicalId":110529,"journal":{"name":"2017 IEEE International Conference on Electrical, Instrumentation and Communication Engineering (ICEICE)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE International Conference on Electrical, Instrumentation and Communication Engineering (ICEICE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEICE.2017.8191950","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

The wire-length of vertically stacked ICs plays a vital role. The wire-length is minimized by using differential evolutionary algorithms withIBM Benchmark inputs. Moreover this wire length is minimized with the respect to the length of the Through Silicon via (TSVs). As a result, the wire-length has been minimized using this algorithm with various parameters. Experimental result shows that the total wirelength can be reduced.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于差分进化算法的三维集成电路布线中的最小布线长度
垂直堆叠集成电路的线长起着至关重要的作用。通过使用ibm基准输入的差分进化算法,将线长度最小化。此外,该导线长度相对于硅通孔(tsv)的长度是最小的。结果表明,该算法在各种参数下都能最大限度地减小线长。实验结果表明,该方法可以减小总长度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Perturb and Observe (P&O) based MPPT controller for PV connected brushless DC motor drive Design of smart meter for smart grid application through true time — MATLAB Design and analysis of FPGA based 32 bit ALU using reversible gates Fault tolerant improvement mechanism for 3D memories using built-in self repair scheme Study of radiation patterns of circular patch antenna at different modes
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1