Application of polymer-thick-film-technology (PTF) for environmentally friendly electronic devices

Abstract

The industry is increasingly confronted with the necessity of solving the problems associated with the disposal of discarded goods. The impact that products have on the environment is becoming an important criterion in marketing products. On account of this, the technological process steps in production of electronic devices, their use and their disposal have to be environmentally acceptable. The paper intends to describe the feasibility of building an environmentally friendly device by use of polymer thick film technology (PTF) for printed components and tracks on silicone substrates. The use of PTF for tracks is eco-friendly because the patterning should take place in principle without endangering the environment through chemical treatment. The use of flexible inks on flexible silicone substrates without harmful flame retarding chemical substances makes the whole circuit board especially eco-friendly and allows the building of a space-saving 3D-package. Another measure is the elimination of mounted components such as resistors, coils and capacitors, because they consist of different parts and consequently of several materials. Printing of these components is possible and well-known from hybrid electronics. Printed devices do not need a conventional mounting process, and in polymer technology they consist of a resin which is filled with an active substance.