Comprehensive Study of ESD Design Window Scaling Down to 7nm Technology Node

Aihua Dong, J. Xiong, S. Mitra, Wei Liang, R. Gauthier, A. Loiseau
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引用次数: 15

Abstract

ESD design window for mainstream bulk and SOI planar/FinFET technologies across 350nm7nm node are compared for the first time. 100ns TLP and 1ns vfTLP characteristics of Vgox, and Vt1, and It2 of various logic and I/O FETs are presented anddiscussed. Expanding the design window by utilizing series resistance within I/O driversis discussed.
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ESD设计窗口缩窄至7nm工艺节点的综合研究
在350nm7nm节点上,首次比较了主流块体和SOI平面/FinFET技术的ESD设计窗口。介绍并讨论了Vgox的100ns TLP和1ns vftp特性,以及各种逻辑和I/O fet的Vt1和It2特性。讨论了在I/O驱动中利用串联电阻来扩展设计窗口。
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