Comparative analysis of thermal and optical properties for the LEDs with different circuit boards

Jiajia Fu, Haizhong Xie, H. Cao, Lixia Zhao, Xuejiao Sun, Baojun Sun, Junxi Wang, Jinmin Li
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引用次数: 1

Abstract

We have fabricated three types of high power LEDs with different circuit boards: Al2O3 ceramic board, epoxy PCB with Cu-deposited on the wall of holes and epoxy PCB with Cu-filled through holes. The different contribution of the package have been separated and investigated by using the derivative of temperature rise in the time domain and thermal transient method. The results show that although the thermal conductivity coefficient of epoxy PCB is much smaller than that of ceramic, PCB integrated with Cu can improve the heat-dissipation significantly and decrease the thermal resistance. In addition, this design can also improve the EQE droop effect.
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不同电路板对led的热光学性能的比较分析
我们用不同的电路板制作了三种类型的大功率led: Al2O3陶瓷板,孔壁上镀铜的环氧PCB和填充铜的环氧PCB通孔。采用时域温升导数法和热瞬态法,对包体的不同贡献进行了分离和研究。结果表明,虽然环氧树脂PCB板的导热系数远小于陶瓷PCB板,但与Cu集成的PCB板可以显著改善其散热性,降低热阻。此外,本设计还可以改善EQE的下垂效果。
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