Implementation of Millimeter Wave Antenna Arrays by Diffusion Bonding

E. García-Marín, J. Masa-Campos, P. Sánchez-Olivares
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引用次数: 2

Abstract

The possibilities of hardware miniaturization and bandwidth enhancement at millimeter-wave frequencies are regarded with great interest, specially for the incoming 5G communication environment. However, conventional manufacturing techniques struggle to provide the accuracy and tolerances required in radiofrequency devices at this frequency. In this work, a W-band circularly polarized 16×16 antenna array with a corporate waveguide feeding network is presented. Diffusion bonding manufacturing technique has enabled a working prototype with satisfactory experimental results, namely a 5.6 % effective bandwidth at 90 GHz with efficiency over 50 % and axial ratio under 3 dB.
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利用扩散键合技术实现毫米波天线阵列
人们对毫米波频率下硬件小型化和带宽增强的可能性非常感兴趣,特别是对于即将到来的5G通信环境。然而,传统的制造技术难以在该频率下提供射频设备所需的精度和公差。在这项工作中,提出了一个w波段圆极化16×16天线阵列与公司波导馈电网络。扩散键合制造技术实现了一个工作样机,实验结果令人满意,即在90 GHz时有效带宽为5.6%,效率超过50%,轴比低于3 dB。
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