{"title":"Mesurements of Thin Polymer Films Employing Split Post Dielectric Resonator Technique","authors":"M. Jacob, J. Krupka, K. Derzakowski, J. Mazierska","doi":"10.1109/MIKON.2006.4345156","DOIUrl":null,"url":null,"abstract":"Split post dielectric resonator (SPDR) operating at frequency about 10 GHz has been used for measurements of permittivity and dielectric loss tangent of thin polymer films deposited on a thin low loss polymer substrate. Uncertainty analysis and experiments have shown that it is possible to measure real permittivity and dielectric loss tangent of thin polymer films deposited on thin low loss dielectric substrates. Appropriate sensitivity of measurements can be achieved by stacking several substrates with deposited film together and thus creating multilayered dielectric structure.","PeriodicalId":315003,"journal":{"name":"2006 International Conference on Microwaves, Radar & Wireless Communications","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 International Conference on Microwaves, Radar & Wireless Communications","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MIKON.2006.4345156","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
Split post dielectric resonator (SPDR) operating at frequency about 10 GHz has been used for measurements of permittivity and dielectric loss tangent of thin polymer films deposited on a thin low loss polymer substrate. Uncertainty analysis and experiments have shown that it is possible to measure real permittivity and dielectric loss tangent of thin polymer films deposited on thin low loss dielectric substrates. Appropriate sensitivity of measurements can be achieved by stacking several substrates with deposited film together and thus creating multilayered dielectric structure.