Kaixue Ma, K. Yeo, Shouxian Mou, N. Mahalingam, Yisheng Wang, Bharatha Kumar Thangarasu, Jinna Yan, Wanxin Ye, Keping Wang, W. M. Lim, T. S. Wong, Yang Lu, Wanlan Yang, Khiam-Boon Png, F. Chin, Xiaoming Peng, Albert Chai, Z. Guoping, C. Yoong, Yin Jee Khoi, Z. Weiqiang, Qu Xuhong, Law Sie Yong, Zhao Cheng, C. Simon, Cheng Wang Cho, J.C. Bo, X. Qing, Zhining Chen
{"title":"A fully integrated 60GHz dual-chip wireless solution for IEEE802.11ad applications (Invited)","authors":"Kaixue Ma, K. Yeo, Shouxian Mou, N. Mahalingam, Yisheng Wang, Bharatha Kumar Thangarasu, Jinna Yan, Wanxin Ye, Keping Wang, W. M. Lim, T. S. Wong, Yang Lu, Wanlan Yang, Khiam-Boon Png, F. Chin, Xiaoming Peng, Albert Chai, Z. Guoping, C. Yoong, Yin Jee Khoi, Z. Weiqiang, Qu Xuhong, Law Sie Yong, Zhao Cheng, C. Simon, Cheng Wang Cho, J.C. Bo, X. Qing, Zhining Chen","doi":"10.1109/APMC.2015.7411761","DOIUrl":null,"url":null,"abstract":"This paper presents our developed dual-chip wireless communication solution adhering to the IEEE 802.11ad standards. The solution is based on a fully integrated baseband IC (BBIC) embedded with USB3.0 interfaces and a low power 60 GHz transceiver SOC (RFIC) embedded inside an antenna in packaging system. The BBIC uses frequency domain equalizer and preambles to perform synchronization, automatic gain control, estimation and compensation for better system performance. A low power 60GHz RFIC using a sub-harmonic sliding-IF scheme is fully integrated based on low cost SiGe 0.18 um BiCMOS process.","PeriodicalId":269888,"journal":{"name":"2015 Asia-Pacific Microwave Conference (APMC)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 Asia-Pacific Microwave Conference (APMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APMC.2015.7411761","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper presents our developed dual-chip wireless communication solution adhering to the IEEE 802.11ad standards. The solution is based on a fully integrated baseband IC (BBIC) embedded with USB3.0 interfaces and a low power 60 GHz transceiver SOC (RFIC) embedded inside an antenna in packaging system. The BBIC uses frequency domain equalizer and preambles to perform synchronization, automatic gain control, estimation and compensation for better system performance. A low power 60GHz RFIC using a sub-harmonic sliding-IF scheme is fully integrated based on low cost SiGe 0.18 um BiCMOS process.
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