One-directional 3D-SiC MESFET for high power applications

Ramana Thakkallapally, Vamshi Veesam, I. Abdel-Motaleb, Zheng Shen
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引用次数: 4

Abstract

A one-directional 3D normally-on SiC MESFET, suitable for safe multi-KW/cm2 power applications, is designed and analyzed using the numerical analysis simulator, Silvaco Atlas. The analyses show that the drain current is a 100% higher than a surface device with the same dimensions, while occupying less than 33% of the area. At gate voltage of 0V, the drain current reaches 600 mA/mm with a breakdown voltage greater than 600V. The proposed vertical structure allows for more efficient heat dissipation and can be easily connected in parallel to provide power of more than 10 kW/cm2.
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用于高功率应用的单向3D-SiC MESFET
利用数值分析模拟器Silvaco Atlas设计并分析了一种适用于多kw /cm2功率应用的单向3D常通SiC MESFET。分析表明,漏极电流比相同尺寸的表面器件高100%,而所占面积不到33%。栅极电压为0V时,漏极电流达到600ma /mm,击穿电压大于600V。拟议的垂直结构允许更有效的散热,并且可以很容易地并联,提供超过10 kW/cm2的功率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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