{"title":"Analysis of the feasibility of dynamic thermal testing in digital circuits","authors":"J. Altet, A. Rubio, H. Tamamoto","doi":"10.1109/ATS.1997.643951","DOIUrl":null,"url":null,"abstract":"Temperature can be used as a test observable: some failures when activated produce an increase in local power dissipation, changing the surface thermal map of the IC, being detectable with built-in thermal sensors. In this work, both the feasibility of this testing technique and the generation of the specific test pattern are discussed.","PeriodicalId":330767,"journal":{"name":"Proceedings Sixth Asian Test Symposium (ATS'97)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings Sixth Asian Test Symposium (ATS'97)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ATS.1997.643951","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
Temperature can be used as a test observable: some failures when activated produce an increase in local power dissipation, changing the surface thermal map of the IC, being detectable with built-in thermal sensors. In this work, both the feasibility of this testing technique and the generation of the specific test pattern are discussed.
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