A PCB based package and 3D assembly for high power density converters

Abstract

This paper presents a new power module suitable for wide band-gap device packaging. The module is a switching cell composed of a power stage, bypass capacitors, a bootstrap gate driver and an output inductor. The power stage is arranged in a 3D vertical structure. The stray loop inductance is extremely thus small due to a vertically placed ceramic capacitor. The module incorporates a gate driver and an output reactor using a molded compound material as a magnetic core. The paper shows prototype cross sections showing the component embedded in the printed circuit board (PCB) substrate, static electrical characterization of the chip and the switching performance of this package.