Reliability improvement in field-MOS FETs with thick gate oxide for 300-V applications

T. Miyoshi, T. Tominari, Y. Hayashi, T. Oshima, S. Wada, J. Noguchi
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引用次数: 5

Abstract

The reliability of high performance Field-PMOS FET with thick gate oxide was improved. By reducing the amount of charge in the insulating film, RESURF effect was well performed in the drift region to obtain BVDSS over 350 V. Gate oxide breakdown voltage was found to decrease at AC high slew rate, and its reduction was suppressed with the fluorine termination. NBTI shift was also reduced within 15% in a product lifetime. The fluorine termination works as suppressing parasitic charge traps effect in the oxide.
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300v应用中厚栅氧化场mos场效应管的可靠性改进
提高了厚栅氧化层场效应晶体管的可靠性。通过减少绝缘膜中的电荷量,在漂移区充分发挥了RESURF效应,获得了350 V以上的BVDSS。在交流高转换率下,栅极氧化物击穿电压降低,但其降低被氟终止所抑制。NBTI偏移也在产品生命周期内减少了15%。氟末端抑制了氧化物中的寄生电荷陷阱效应。
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