{"title":"W-band monopole antenna-in-system design approached on molding compound material","authors":"C. Jin, Rui Li, Xiaowu Zhang, A. Alphones","doi":"10.1109/APCAP.2012.6333139","DOIUrl":null,"url":null,"abstract":"A planar high-gain W-band unidirectional monopole antenna is designed on the molding compound (MC) material for highly integrated millimeter wave transceivers such as radio system-on-chip and radio system-in-package architectures. The antenna is designed based on the modification of the monopole antenna fed by a coplanar waveguide (CPW). The antenna, for the first time, is designed and fabricated on the MC package format to realize the integrated on-chip level circuit package antenna. Besides economical advantage of mass production and automatic assembly, the proposed design on MC material has potential benefit to the system-level board miniaturization and system-level manufacturing facility.","PeriodicalId":178493,"journal":{"name":"2012 IEEE Asia-Pacific Conference on Antennas and Propagation","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE Asia-Pacific Conference on Antennas and Propagation","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APCAP.2012.6333139","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A planar high-gain W-band unidirectional monopole antenna is designed on the molding compound (MC) material for highly integrated millimeter wave transceivers such as radio system-on-chip and radio system-in-package architectures. The antenna is designed based on the modification of the monopole antenna fed by a coplanar waveguide (CPW). The antenna, for the first time, is designed and fabricated on the MC package format to realize the integrated on-chip level circuit package antenna. Besides economical advantage of mass production and automatic assembly, the proposed design on MC material has potential benefit to the system-level board miniaturization and system-level manufacturing facility.