{"title":"High-speed system bus for a SoC network processing platform","authors":"J.P. Bissou, M. Dubois, Y. Savaria, G. Bois","doi":"10.1109/ICM.2003.238564","DOIUrl":null,"url":null,"abstract":"Interconnecting modules in a SoC platform requires modules compatibility. Several solutions are available, but they either lack the necessary throughput or the flexibility. This paper proposes an interconnection architecture for a flexible on-chip high-performance communication medium that can provide variable bandwidth. It is based on the AHB AMBA bus. The proposed architecture has been implemented in the Seamless environment and laid out using a 0.18 /spl mu/m CMOS with Cadence tools to validate the proposed concept.","PeriodicalId":180690,"journal":{"name":"Proceedings of the 12th IEEE International Conference on Fuzzy Systems (Cat. No.03CH37442)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 12th IEEE International Conference on Fuzzy Systems (Cat. No.03CH37442)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICM.2003.238564","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Interconnecting modules in a SoC platform requires modules compatibility. Several solutions are available, but they either lack the necessary throughput or the flexibility. This paper proposes an interconnection architecture for a flexible on-chip high-performance communication medium that can provide variable bandwidth. It is based on the AHB AMBA bus. The proposed architecture has been implemented in the Seamless environment and laid out using a 0.18 /spl mu/m CMOS with Cadence tools to validate the proposed concept.