High-speed system bus for a SoC network processing platform

J.P. Bissou, M. Dubois, Y. Savaria, G. Bois
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引用次数: 7

Abstract

Interconnecting modules in a SoC platform requires modules compatibility. Several solutions are available, but they either lack the necessary throughput or the flexibility. This paper proposes an interconnection architecture for a flexible on-chip high-performance communication medium that can provide variable bandwidth. It is based on the AHB AMBA bus. The proposed architecture has been implemented in the Seamless environment and laid out using a 0.18 /spl mu/m CMOS with Cadence tools to validate the proposed concept.
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用于SoC网络处理平台的高速系统总线
SoC平台中模块的互连需要模块兼容性。有几种解决方案可用,但它们要么缺乏必要的吞吐量,要么缺乏灵活性。提出了一种可提供可变带宽的柔性片上高性能通信介质的互连体系结构。它基于AHB AMBA总线。所提出的架构已经在Seamless环境中实现,并使用带有Cadence工具的0.18 /spl mu/m CMOS进行布局,以验证所提出的概念。
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