{"title":"Practical application of fine pitch component mounting with precoat soldering","authors":"T. Amano, H. Shiroishi, M. Kohno, Y. Obara","doi":"10.1109/IEMT.1993.398226","DOIUrl":null,"url":null,"abstract":"By combining the key capability of Super Solder precoat to supply high volumes of solder with the new pad geometry, major improvements are demonstrated in volume production mountability and mounting reliability for fine pitch components. In particular, a solder precoat supporting repair of a 0.3 mm pitch tape automated bonding (TAB) components is possible. A pad design permitting reflow mounting of quad flatpack (QFP) packages is discussed.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"61 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.398226","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
By combining the key capability of Super Solder precoat to supply high volumes of solder with the new pad geometry, major improvements are demonstrated in volume production mountability and mounting reliability for fine pitch components. In particular, a solder precoat supporting repair of a 0.3 mm pitch tape automated bonding (TAB) components is possible. A pad design permitting reflow mounting of quad flatpack (QFP) packages is discussed.<>
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