Strong Fault-Tolerance for Self-Assembly with Fuzzy Temperature

David Doty, Matthew J. Patitz, D. Reishus, R. Schweller, Scott M. Summers
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引用次数: 42

Abstract

We consider the problem of fault-tolerance in nanoscale algorithmic self-assembly. We employ a standard variant of Winfree’s abstract Tile Assembly Model (aTAM), the two-handed aTAM, in which square “tiles” – a model of molecules constructed from DNA for the purpose of engineering self-assembled nanostructures – aggregate according to specific binding sites of varying strengths, and in which large aggregations of tiles may attach to each other, in contrast to the seeded aTAM, in which tiles aggregate one at a time to a single specially designated “seed” assembly. We focus on a major cause of errors in tile-based self-assembly: that of unintended growth due to “weak” strength-1 bonds, which if allowed to persist, may be stabilized by subsequent attachment of neighboring tiles in the sense that at least energy 2 is now required to break apart the resulting assembly, i.e., the errant assembly is stable at temperature 2. We study a common self-assembly benchmark problem, that of assembling an n×n square using O(log n) unique tile types, under the two-handed model of self-assembly. Our main result achieves a much stronger notion of fault-tolerance than those achieved previously. Arbitrary strength-1 growth is allowed, however, any assembly that grows sufficiently to become stable at temperature 2 is guaranteed to assemble into the correct final assembly of an n×n square. In other words, errors due to insufficient attachment, which is the cause of errors studied in earlier papers on fault-tolerance, are prevented absolutely in our main construction, rather than only with high probability and for sufficiently small structures, as in previous fault tolerance studies.
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模糊温度自组装的强容错性
研究了纳米尺度算法自组装中的容错问题。我们采用了Winfree抽象瓷砖组装模型(aTAM)的一个标准变体,即双手aTAM,其中方形“瓷砖”——一种由DNA构建的分子模型,用于工程自组装纳米结构——根据不同强度的特定结合位点聚集,其中大块的瓷砖可以相互附着,与种子aTAM相反,在种子aTAM中,瓷砖一次聚集一个,形成一个专门指定的“种子”组装。我们关注基于瓷砖的自组装错误的主要原因:由于“弱”强度-1键而导致的意外增长,如果允许其持续存在,可能会通过随后的相邻瓷砖的附着来稳定,因为现在至少需要能量2来分解产生的组装,即错误的组装在温度2下是稳定的。我们研究了一个常见的自组装基准问题,即在自组装的双手模型下,使用O(log n)个唯一瓦片类型组装一个n×n正方形的问题。我们的主要结果实现了比以前更强的容错概念。允许任意强度-1的增长,但是,任何在温度- 2下足够稳定的组件都可以保证组装成n×n方形的正确最终组件。换句话说,在我们的主结构中,完全可以避免由于连接不足而导致的错误,而不是像以前的容错研究那样,只有高概率和足够小的结构才会发生错误。
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