Full-Integrated power module for motor drive applications

Abstract

This paper proposes an IGBT-based full-integrated power module (FIPM) that we have newly developed for compactness, high performance and low cost motor drive applications. It integrates all necessary power and control components to form a motor control system for the inverter air conditioner. Inside the FIPM there are a copper-dielectric-aluminum (CDA) substrate and a printed circuit board (PCB) substrate. All the power components such as the IGBTs and the freewheeling diodes (FWDs) are soldered directly on the CDA substrate, while the low power components such as the gate drivers, the micro control unit (MCU) and the passive components are assembled on the PCB substrate, which offers significant flexibility in the circuit layout. With this type of structure, the switching noise of the power devices that coupling to the gate drivers are effectively prevented. The electrical performance is improved by utilizing trench gate non-punch through (NPT) IGBTs which matched with its anti-parallel FWDs. Additionally, the reliability of the FIPM is further enhanced by using the aluminum layer double-sided oxidizing technology of the CDA substrate. Moreover, a large reduction of the junction to case thermal resistance of this FIPM is achieved by utilizing the half-molded resin package technology, which is especially suitable for the high power applications that need extremely good heat conductivity.