{"title":"Newly developed LCP solvent casting film and its applications","authors":"S. Okamoto","doi":"10.1109/HDP.2006.1707589","DOIUrl":null,"url":null,"abstract":"Commercial aromatic liquid-crystalline polymers (LCP) are known to be unable to dissolve in any common organic solvents. Recently, we succeeded in the development of innovative solvent-casting type LCP by a design of the molecule structure. In addition to standard LCP film properties such as environmental compatibility, moisture resistance and heat resistance, the casting-type LCP film exhibits less anisotropy, high adhesion to copper foils and peculiar behavior of modulus of elasticity suitable for mounting IC chip. The solvent-casting type LCP has many advantages to be applied for the various electro devices","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HDP.2006.1707589","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Commercial aromatic liquid-crystalline polymers (LCP) are known to be unable to dissolve in any common organic solvents. Recently, we succeeded in the development of innovative solvent-casting type LCP by a design of the molecule structure. In addition to standard LCP film properties such as environmental compatibility, moisture resistance and heat resistance, the casting-type LCP film exhibits less anisotropy, high adhesion to copper foils and peculiar behavior of modulus of elasticity suitable for mounting IC chip. The solvent-casting type LCP has many advantages to be applied for the various electro devices
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