J. Czernohorsky, B. Maj, M. Viering, L. Wright, G. Balanon
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Abstract
Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).
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