Analysis of Microwave Resonances in a Wirebond Transition between Conductor-Backed Coplanar Waveguides (CBCPWs)

JuHwan Lim, Sungwoo Hwang
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引用次数: 3

Abstract

Microwave resonances in a wirebond transition between conductor-backed coplanar waveguides (CBCPWs) on two different substrates (alumina and silicon) are investigated by using on-wafer measurements and three-dimensional (3D) electromagnetic (EM) simulations in the frequency range from 1 to 26.5 GHz. The simulated resonant frequencies are in good agreement with the measured ones. For the first time, we clearly identify cascaded resonance modes of wirebond transition structures with two different substrates, by the electric field distribution at the resonant frequencies. The transition between the CPW grounds of the two substrates act as a node separating the modes, and consequently forming both the mode of the entire structure and the cascade of two different resonant modes on two substrates
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同轴共面波导(cbcpw)线键跃迁中的微波共振分析
利用晶片上测量和1 ~ 26.5 GHz频率范围内的三维电磁(EM)模拟,研究了两种不同衬底(氧化铝和硅)上的共面波导(cbcpw)之间的线键转换中的微波共振。模拟的谐振频率与实测值吻合较好。我们首次通过共振频率处的电场分布,清晰地识别了两种不同衬底的线键过渡结构的级联共振模式。两个衬底的CPW接地之间的过渡充当了分离模式的节点,从而形成了整个结构的模式和两个衬底上两种不同谐振模式的级联
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