Measurements of solder bump lifetime as a function of underfill material properties

Abstract

This paper presents measurements of the number of thermal cycles to failure for eutectic solder bumps in flip-chip-on-board (FCOB) circuits with and without underfill. The bump lifetime is measured as a function of the distance to the chip centre for two different underfill materials. The results show that the lifetime of the solder bumps under thermal cycling from -55-145/spl deg/C decreases with increasing thermal expansion coefficient (CTE) of the underfill material. For a filled epoxy underfill with CTE=28 ppm/K, nearly matched to the CTE of solder, the measurements so far indicate that the number of cycles to failure is around 2000, compared to 50-80 cycles for devices without underfill. For a pure epoxy underfill (CTE=58 ppm/K) the measured lifetime of the solder bumps is 400-500 cycles. The lifetime measurements are compared to an analytical model of the number of cycles to failure based on calculations of axial and shear solder strain. For devices without underfill and with the underfill with the highest CTE, the measured number of cycles to failure are around 50% higher than predicted by the model. For the underfill with the lowest CTE, preliminary results indicate that the lifetime is close to or slightly higher than the predicted values. For both samples, there is only a small variation of lifetime with the distance to the chip centre. This indicates that axial strain plays a dominant role in the mechanical wearout of the solder bumps.