Y. Pu, D. Butterfield, Jorge A. García, Jing Xie, Mark Lin, Rohit Sauhta, Rick Farley, Steven Shellhammer, Moses Derkalousdian, Adam Newham, Chunlei Shi, R. Shenoy, Evgeni Gousev, Rashid Attar
{"title":"An Ultra-low-power 28nm CMOS Dual-die ASIC Platform for Smart Hearables","authors":"Y. Pu, D. Butterfield, Jorge A. García, Jing Xie, Mark Lin, Rohit Sauhta, Rick Farley, Steven Shellhammer, Moses Derkalousdian, Adam Newham, Chunlei Shi, R. Shenoy, Evgeni Gousev, Rashid Attar","doi":"10.1109/BIOCAS.2018.8584806","DOIUrl":null,"url":null,"abstract":"This paper presents an ultra-low-power dual-die platform for (medical) smart hearables. It pairs two custom ASICs: i) Blackghost - a 28nm CMOS near-threshold-VDDpowered and highly integrated SoC with embedded PMU, MCU, 16-issue DSP engine and hardened audio sub-system island; ii) DIRAC - a 28nm CMOS always-on voiceband RF & mixed-signal audio codec frontend. With ~90dB of dynamic range, DIRAC codec consumes <200µW of total power. For fast wakeup, sleep and standby of Blackghost, DIRAC also features low latency microphone activity detection (MAD) and TX-RX cross fading scheme. This dual-die platform enables miniaturized hearable devices capable of running emerging audio algorithms like deep learning at an extremely low enerzy budget.","PeriodicalId":259162,"journal":{"name":"2018 IEEE Biomedical Circuits and Systems Conference (BioCAS)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Biomedical Circuits and Systems Conference (BioCAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/BIOCAS.2018.8584806","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
This paper presents an ultra-low-power dual-die platform for (medical) smart hearables. It pairs two custom ASICs: i) Blackghost - a 28nm CMOS near-threshold-VDDpowered and highly integrated SoC with embedded PMU, MCU, 16-issue DSP engine and hardened audio sub-system island; ii) DIRAC - a 28nm CMOS always-on voiceband RF & mixed-signal audio codec frontend. With ~90dB of dynamic range, DIRAC codec consumes <200µW of total power. For fast wakeup, sleep and standby of Blackghost, DIRAC also features low latency microphone activity detection (MAD) and TX-RX cross fading scheme. This dual-die platform enables miniaturized hearable devices capable of running emerging audio algorithms like deep learning at an extremely low enerzy budget.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
