M. Bazu, V. Ilian, L. Galateanu, D. Varsescu, A. Pietrikova
{"title":"Reliability testing of lead-free solder joints","authors":"M. Bazu, V. Ilian, L. Galateanu, D. Varsescu, A. Pietrikova","doi":"10.1109/ISSE.2012.6273133","DOIUrl":null,"url":null,"abstract":"For studying the reliability of lead-free SnAgCu solder joints, reliability test were performed on test structures obtained by three variants of PCB surface finishing: Copper, Gold and HASL (Hot Air Solder Levelling), respectively, achieved by an industrial process and, in parallel, by in laboratory (research) conditions. Two types of reliability tests were used: (i) Thermal cycling at -55°C / +125°C / 30 minutes at each step; (ii) Cycling damp heat at -40°C / 85°C and 85%RH. The results clearly show that both the industrial process and the research conditions ensure the higher reliability level for the HASL variant.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2012.6273133","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
For studying the reliability of lead-free SnAgCu solder joints, reliability test were performed on test structures obtained by three variants of PCB surface finishing: Copper, Gold and HASL (Hot Air Solder Levelling), respectively, achieved by an industrial process and, in parallel, by in laboratory (research) conditions. Two types of reliability tests were used: (i) Thermal cycling at -55°C / +125°C / 30 minutes at each step; (ii) Cycling damp heat at -40°C / 85°C and 85%RH. The results clearly show that both the industrial process and the research conditions ensure the higher reliability level for the HASL variant.
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