Pub Date : 2012-08-20DOI: 10.1109/ISSE.2012.6273143
N. Nenov, E. Dimitrov, V. Vasilev, V. Nikolov
The paper presents a model solution for implementing electronic monitoring systems to control the technical condition of vehicles by proper interpretation of the electrical signal experimentally acquired by an accelerometer. Despite the variety of influencing factors, an approach using Wavelet-decomposition of the signal is given to substitute the classical decomposition in Fourier series. The aim is to get more adequate visualization of the ongoing process of moving vehicles-track interaction. MATLAB is used for numerical processing and presentation of results.
{"title":"Examination of the signal recorded by micro sensor system for detecting damages on rail vehicle undercarriage","authors":"N. Nenov, E. Dimitrov, V. Vasilev, V. Nikolov","doi":"10.1109/ISSE.2012.6273143","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273143","url":null,"abstract":"The paper presents a model solution for implementing electronic monitoring systems to control the technical condition of vehicles by proper interpretation of the electrical signal experimentally acquired by an accelerometer. Despite the variety of influencing factors, an approach using Wavelet-decomposition of the signal is given to substitute the classical decomposition in Fourier series. The aim is to get more adequate visualization of the ongoing process of moving vehicles-track interaction. MATLAB is used for numerical processing and presentation of results.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"208 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-08-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121273516","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273137
K. Dušek, V. Náhlík
Soldering is the process of joining two metals by the use of a solder alloy. Joining material such as copper and other materials used in electronics assembly rapidly oxidize upon exposure to air, moisture, and heat. Reliable solder connections can only be accomplished with truly cleaned surfaces. For this purpose are used fluxes in electronics assembly. Flux is a chemical cleaner which removes oxidation from metal surfaces - cleans surfaces that are going to be joined together to enhance wetting by solder in the molten state. On the other hand flux can cause problems with future reliability due to aggressive residues which have conducting or corrosive properties. There are varieties of fluxes available for many purposes and applications. The most common types of fluxes include: Rosin - No Clean, Rosin - Mildly Activated and Water Soluble. This article deals with observation of commonly used fluxes aggression on copper surface in electronics assembly during the reflow process. Ten types of fluxes were compared in our experiment. Measurement was carried on glass samples with copper vapor deposition. Determination of flux aggression on copper surface was based on the measurement of absorption of light on spectrophotometer.
{"title":"Comparison of commonly used fluxes aggression on copper surface","authors":"K. Dušek, V. Náhlík","doi":"10.1109/ISSE.2012.6273137","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273137","url":null,"abstract":"Soldering is the process of joining two metals by the use of a solder alloy. Joining material such as copper and other materials used in electronics assembly rapidly oxidize upon exposure to air, moisture, and heat. Reliable solder connections can only be accomplished with truly cleaned surfaces. For this purpose are used fluxes in electronics assembly. Flux is a chemical cleaner which removes oxidation from metal surfaces - cleans surfaces that are going to be joined together to enhance wetting by solder in the molten state. On the other hand flux can cause problems with future reliability due to aggressive residues which have conducting or corrosive properties. There are varieties of fluxes available for many purposes and applications. The most common types of fluxes include: Rosin - No Clean, Rosin - Mildly Activated and Water Soluble. This article deals with observation of commonly used fluxes aggression on copper surface in electronics assembly during the reflow process. Ten types of fluxes were compared in our experiment. Measurement was carried on glass samples with copper vapor deposition. Determination of flux aggression on copper surface was based on the measurement of absorption of light on spectrophotometer.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125968043","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273108
A. Géczy, Z. Péter, B. Illés, Z. Illyefalvi-Vitéz
Vapour Phase Soldering (VPS) [1] has become a significant alternative method for reflow soldering in the last years [2-3]. Since the technology is based on heat transfer principles, which are totally different from the conventional reflow technologies (forced convection or IR), a new approach is needed for the characterization of the processing zone inside the vapour chamber. This paper presents the results of a novel method for characterization: the measurement of pressure differences in the processing zone of a VPS tank. For this purpose, high resolution pressure sensors were applied to a batch type, experimental VPS station. High resolution of the measurement range is a key factor of the method due to the small pressure differences of the process. The measurements correlate to the Galden vapour density and the temperature, which are also important aspects of the experiment.
{"title":"Pressure sensing: A novel method for characterizing the processing zone in Vapour Phase Soldering systems","authors":"A. Géczy, Z. Péter, B. Illés, Z. Illyefalvi-Vitéz","doi":"10.1109/ISSE.2012.6273108","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273108","url":null,"abstract":"Vapour Phase Soldering (VPS) [1] has become a significant alternative method for reflow soldering in the last years [2-3]. Since the technology is based on heat transfer principles, which are totally different from the conventional reflow technologies (forced convection or IR), a new approach is needed for the characterization of the processing zone inside the vapour chamber. This paper presents the results of a novel method for characterization: the measurement of pressure differences in the processing zone of a VPS tank. For this purpose, high resolution pressure sensors were applied to a batch type, experimental VPS station. High resolution of the measurement range is a key factor of the method due to the small pressure differences of the process. The measurements correlate to the Galden vapour density and the temperature, which are also important aspects of the experiment.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123337206","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273148
V. Maříková, M. Winkelhoferova, J. Tupa
This paper deals with the diagnostic processes. The aim is to develop a new methodology leads to complex improvement of diagnostics processes. This paper presents designed methodology for diagnostics process and sample of application of designed methodology. It is focused on methodology which was designed according to needs of diagnostic system. It also include methodology concept and example of application will be shown in the article.
{"title":"Methodology for mapping and modelling of diagnostic processes","authors":"V. Maříková, M. Winkelhoferova, J. Tupa","doi":"10.1109/ISSE.2012.6273148","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273148","url":null,"abstract":"This paper deals with the diagnostic processes. The aim is to develop a new methodology leads to complex improvement of diagnostics processes. This paper presents designed methodology for diagnostics process and sample of application of designed methodology. It is focused on methodology which was designed according to needs of diagnostic system. It also include methodology concept and example of application will be shown in the article.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126864063","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273123
P. Gierth, L. Rebenklau, Alexander Michaelis
Solar cells have to be connected electrically to each other in a solar module. During the last years, new connection techniques with low stress have been developed, such as selective soldering. The industrially most frequently used selective soldering techniques are induction soldering, contact soldering, laser soldering and spot light soldering. The aim of this work is to evaluate the characteristics of solder joints, which are produced by the use of selective soldering techniques. Therefore adhesive strength tests, electrical characterizations and x-ray analyses have been performed. In this process one front-side metallization, a SnAg-solder and a SnPbAg-solder were used. The characterization method will be demonstrated on the spot light soldering technique. In addition the influence of the solder joint quality on the resistance of the whole solar cell will be demonstrated and discussed.
{"title":"Evaluation of soldering processes for high efficiency solar cells","authors":"P. Gierth, L. Rebenklau, Alexander Michaelis","doi":"10.1109/ISSE.2012.6273123","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273123","url":null,"abstract":"Solar cells have to be connected electrically to each other in a solar module. During the last years, new connection techniques with low stress have been developed, such as selective soldering. The industrially most frequently used selective soldering techniques are induction soldering, contact soldering, laser soldering and spot light soldering. The aim of this work is to evaluate the characteristics of solder joints, which are produced by the use of selective soldering techniques. Therefore adhesive strength tests, electrical characterizations and x-ray analyses have been performed. In this process one front-side metallization, a SnAg-solder and a SnPbAg-solder were used. The characterization method will be demonstrated on the spot light soldering technique. In addition the influence of the solder joint quality on the resistance of the whole solar cell will be demonstrated and discussed.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113968333","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273145
N. Samardzic, D. Vasiljević, N. Jerance, G. Stojanović
In this paper, modeling and fabrication of ink-jet printed resonant-circuit sensors are proposed. The sensing principle is described and two different models of sensor have been designed and characterized. The sensor has been tested in air environment as well as dipped in the water for finding the right circuit properties for potential usage in liquid content sensing.
{"title":"Design and fabrication of flexible ink-jet printed resonant-circuit sensor","authors":"N. Samardzic, D. Vasiljević, N. Jerance, G. Stojanović","doi":"10.1109/ISSE.2012.6273145","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273145","url":null,"abstract":"In this paper, modeling and fabrication of ink-jet printed resonant-circuit sensors are proposed. The sensing principle is described and two different models of sensor have been designed and characterized. The sensor has been tested in air environment as well as dipped in the water for finding the right circuit properties for potential usage in liquid content sensing.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124446873","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273158
E. Ceuca, A. Tulbure, S. Pleša
The present paper focuses on studying the behavior of different types of batteries within autonomous systems. The growing need to store energy nowadays has led to intensive research in the field of batteries in order to optimize aspects such as: the charging time, enlarging capacity, reducing dimensions, longer life. Our goal is to provide examples and to find out the best way to produce household energy. This dual energy system has not been implemented in our region yet. The entire project has been designed to supply sufficient necessary daily energy.
{"title":"The battery management in green energy production","authors":"E. Ceuca, A. Tulbure, S. Pleša","doi":"10.1109/ISSE.2012.6273158","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273158","url":null,"abstract":"The present paper focuses on studying the behavior of different types of batteries within autonomous systems. The growing need to store energy nowadays has led to intensive research in the field of batteries in order to optimize aspects such as: the charging time, enlarging capacity, reducing dimensions, longer life. Our goal is to provide examples and to find out the best way to produce household energy. This dual energy system has not been implemented in our region yet. The entire project has been designed to supply sufficient necessary daily energy.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134112652","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273087
B. Psota, M. Bursik, I. Szendiuch
This paper informs about the simulation of the wirebonding process. We are primary focus on a loop formation and definition of the wire behavior during this process. Simulation model of the bonding structure was created and the definition of the loop shape for different application was gained.
{"title":"Optimization of wire loop formation in wirebonding process using computer simulation","authors":"B. Psota, M. Bursik, I. Szendiuch","doi":"10.1109/ISSE.2012.6273087","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273087","url":null,"abstract":"This paper informs about the simulation of the wirebonding process. We are primary focus on a loop formation and definition of the wire behavior during this process. Simulation model of the bonding structure was created and the definition of the loop shape for different application was gained.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131079458","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273156
B. Nagl, E. Suhir, W. Gschohsmann, J. Nicolics
A high-power IGBT (Isolated Gate Bipolar Transistor) module has been thermomechanically analyzed in the moment of switching on short circuit. We studied the extremely rapidly changing temperature distribution within a wire bond by a transient thermal simulation on the basis of an experimentally determined power loss as function of time, a finite element simulation of thermomechanically induced stress and strain distribution within the bond-wire wedge and the silicon chip, and a simple but meaningful analytical model of the same arrangement, with special attention to the interfacial shearing stress as function of time. The analyses revealed a surprising result: during the first few microseconds the extremely high power loss density in the silicon chip causes a rapid temperature increase and expansion of the silicon chip which leads to a tensile stress in the aluminum bond wire, whereas in the consecutive phase the temperature of the aluminum wire approaches the one of the chip, whereby the aluminum wire turns to compressive stress which means a reversal of shear stress at the wire/chip interface. This could be a new explanation for the field failures known.
{"title":"Transient thermomechanical study of a thick-wire bond with particular attention to the interfacial shearing stress","authors":"B. Nagl, E. Suhir, W. Gschohsmann, J. Nicolics","doi":"10.1109/ISSE.2012.6273156","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273156","url":null,"abstract":"A high-power IGBT (Isolated Gate Bipolar Transistor) module has been thermomechanically analyzed in the moment of switching on short circuit. We studied the extremely rapidly changing temperature distribution within a wire bond by a transient thermal simulation on the basis of an experimentally determined power loss as function of time, a finite element simulation of thermomechanically induced stress and strain distribution within the bond-wire wedge and the silicon chip, and a simple but meaningful analytical model of the same arrangement, with special attention to the interfacial shearing stress as function of time. The analyses revealed a surprising result: during the first few microseconds the extremely high power loss density in the silicon chip causes a rapid temperature increase and expansion of the silicon chip which leads to a tensile stress in the aluminum bond wire, whereas in the consecutive phase the temperature of the aluminum wire approaches the one of the chip, whereby the aluminum wire turns to compressive stress which means a reversal of shear stress at the wire/chip interface. This could be a new explanation for the field failures known.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133392036","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273103
D. Seehase, H. Huth, F. Bremerkamp, M. Nowottnick
Strictly speaking standard reflow soldering processes are inefficient in terms of energy consumption. A large amount of energy is needed to heat up comparatively small solder joints. As a result the whole electronic assembly is stressed with heat, of which only a fraction is going into soldering. A reduction of process temperatures would improve this disproportion. To compensate for the resulting lack of energy, an exothermic reaction, releasing additional heat inside the solder paste deposits, could be applied. The potential of such a process has already been proven in earlier works [1], [5]. For the adjustment of such a sensitive process a better understanding of the energetic requirements for solder paste deposits in dependence of their size and temperature is required. In this work such results are generated by a practical measuring approach. Here, a chip resistor is used as a model to melt up particular solder joints through joule heating. The thermal energy is calculated by measuring electrical power over time.
{"title":"Energetic analysis of solder paste deposits as reference for soldering with selective heat","authors":"D. Seehase, H. Huth, F. Bremerkamp, M. Nowottnick","doi":"10.1109/ISSE.2012.6273103","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273103","url":null,"abstract":"Strictly speaking standard reflow soldering processes are inefficient in terms of energy consumption. A large amount of energy is needed to heat up comparatively small solder joints. As a result the whole electronic assembly is stressed with heat, of which only a fraction is going into soldering. A reduction of process temperatures would improve this disproportion. To compensate for the resulting lack of energy, an exothermic reaction, releasing additional heat inside the solder paste deposits, could be applied. The potential of such a process has already been proven in earlier works [1], [5]. For the adjustment of such a sensitive process a better understanding of the energetic requirements for solder paste deposits in dependence of their size and temperature is required. In this work such results are generated by a practical measuring approach. Here, a chip resistor is used as a model to melt up particular solder joints through joule heating. The thermal energy is calculated by measuring electrical power over time.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"715 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115126597","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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