The impact of high glass transition temperature of molding compounds on power package warpage and stress performance

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI:10.1109/EPTC.2015.7412356

Dandong Ge, N. Subramanian, Khai Seen Yong, M. Y. Foo, S. L. Gan

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引用次数: 1

Abstract

High Glass Transition Temperature (Tg) Molding Compound (MCs) are preferred for power and automotive packages due to their suitability in high temperature applications. However, our recent study on high Tg MCs showed that their susceptibility for delamination risk increased especially at low temperature conditions. In this work, three types of Mold Compounds were intentionally selected for evaluation and comparison. There are two High Tg MCs and one normal Tg MC with multi-aromatic resin. Properties of MC samples, mainly their weight loss, Tg, CTE and Storage Modulus, were measured and recorded by means of TGA, Thermal Mechanical Analysis(TMA) and Dynamical Mechanical Analysis(DMA). TMA and DMA were used to characterise the viscoelastic behaviour of 3MCs over temperature. In this study, we evaluated with finite element analysis (FEA) the impact of mold compound on chip deformation and induced stresses at bi-material interfaces within the package for qualitative correlation & risk assessment of chip crack & interfacial delamination during assembly process steps & thermal cycling (TC) reliability test temperatures.

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高玻璃化转变温度对电源封装翘曲和应力性能的影响

高玻璃化转变温度(Tg)成型化合物(mc)是首选的电源和汽车封装，因为它们适合高温应用。然而，我们最近对高Tg MCs的研究表明，它们对分层风险的易感性增加，特别是在低温条件下。在这项工作中，有意选择三种类型的霉菌化合物进行评价和比较。有两种高Tg聚合物和一种含多芳树脂的普通Tg聚合物。采用热失重分析(TGA)、热力学分析(TMA)和动力力学分析(DMA)等方法测定和记录了MC样品的失重、Tg、CTE和储存模量等性能。用TMA和DMA表征了3MCs的超温粘弹性行为。在本研究中，我们通过有限元分析(FEA)评估了模具化合物对封装内双材料界面上切屑变形和诱导应力的影响，以便在装配过程步骤和热循环(TC)可靠性测试温度期间进行切屑裂纹和界面分层的定性关联和风险评估。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

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