{"title":"A 1mm2 flip-chip SP3T switch and low noise amplifier RFIC FEM for 802.11b/g applications","authors":"C. Hale, R. Baeten","doi":"10.1109/RWS.2010.5434209","DOIUrl":null,"url":null,"abstract":"This paper presents a 1mm2 Cu pillar flip chip SP3T/LNA RFIC targeted for use in 802.11b/g front-ends. The SP3T switch enables WLAN transmit/receive and Bluetooth modes of operation. This switch exhibits 0.6dB insertion loss per branch and delivers 802.11g linear performance up to +21dBm output power. A single-stage LNA with a bypass mode is connected after the WLAN Rx branch to increase overall receiver sensitivity and dynamic range. The LNA achieved 1.9dB NF with a typical 11.5dB small-signal gain, including the switch loss. This die occupies only 25% of the footprint of similar existing QFN style WLAN front ends.","PeriodicalId":334671,"journal":{"name":"2010 IEEE Radio and Wireless Symposium (RWS)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-01-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE Radio and Wireless Symposium (RWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RWS.2010.5434209","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
This paper presents a 1mm2 Cu pillar flip chip SP3T/LNA RFIC targeted for use in 802.11b/g front-ends. The SP3T switch enables WLAN transmit/receive and Bluetooth modes of operation. This switch exhibits 0.6dB insertion loss per branch and delivers 802.11g linear performance up to +21dBm output power. A single-stage LNA with a bypass mode is connected after the WLAN Rx branch to increase overall receiver sensitivity and dynamic range. The LNA achieved 1.9dB NF with a typical 11.5dB small-signal gain, including the switch loss. This die occupies only 25% of the footprint of similar existing QFN style WLAN front ends.
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