Thermal advantages of a new microcircuit configuration

T. D. Pestorius, V. Gregory, A. Kraus
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引用次数: 1

Abstract

A comparison is made of two different microcircuit package configurations, a traditional ceramic and kovar steel package is compared to ultrathin polyimide/polyetherimide which is cast directly on a copper foil and laminated to an aluminum plate. The comparison is in the form of a thermal analysis. It shows that the aluminum plate with the thin dielectric is superior from a thermal management standpoint. It is expected that this combination will also provide cost and weight advantages over the more traditional materials as well.<>
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一种新型微电路结构的热优势
对两种不同的微电路封装结构进行了比较,将传统的陶瓷和kovar钢封装与直接铸造在铜箔上并层压在铝板上的超薄聚酰亚胺/聚醚亚胺封装进行了比较。比较是以热分析的形式进行的。从热管理的角度来看,具有薄电介质的铝板是优越的。预计与传统材料相比,这种组合也将提供成本和重量优势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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