Composition control of GexSbyTez film for PCRAM application by chemical vapor deposition

T. Horiike, S. Hamada, T. Uno, H. Machida, M. Ishikawa, H. Sudo, Y. Ohshita, A. Ogura
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引用次数: 1

Abstract

This paper describes chemical vapor deposition (CVD) of GeSbTe (GST) film for fabricating phase change memory, especially for the back end of line memory application. We successfully controlled the film composition including stoichiometric Ge2Sb2Te5 by changing deposition conditions. The deposited films had a significantly smooth surface and it was possible to fill a high aspect hole. The mechanism to control the film composition in a high aspect hole is discussed in detail based on the precursor interferences experiment in the cavity.
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化学气相沉积用于PCRAM的GexSbyTez薄膜的成分控制
本文介绍了化学气相沉积(CVD) GeSbTe (GST)薄膜用于相变存储器的制备,特别是用于后端线存储器的应用。通过改变沉积条件,我们成功地控制了薄膜的化学组成,包括Ge2Sb2Te5。沉积的薄膜具有明显的光滑表面,并且可以填充高向孔。基于腔内前驱体干涉实验,详细讨论了在高向孔中控制膜成分的机理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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