Pulsed Laser Assisted Chemical Etch for analytic surface preparation

R. Chivas, S. Silverman, N. Dandekar
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引用次数: 2

Abstract

Pulsed Laser Assisted Chemical Etching (PLACE) is an advanced method of surface preparation for analytic investigations such as: Focused Ion Beam (FIB) circuit edit, Failure Analysis chemical processes (poly-Si etch), Backside SIMS and Optical techniques such as Photoemission Microscopy. PLACE can achieve ultra-high purity and fine dimensional control since it is a dry process relying on pyrolytic vapor phase reactions initiated, and constrained, by a pulsed laser.
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脉冲激光辅助化学蚀刻分析表面制备
脉冲激光辅助化学蚀刻(PLACE)是一种先进的表面制备方法,用于分析研究,如:聚焦离子束(FIB)电路编辑,失效分析化学过程(多晶硅蚀刻),背面SIMS和光学技术,如光电显微镜。PLACE可以实现超高纯度和精细的尺寸控制,因为它是一个干燥的过程,依赖于由脉冲激光引发和约束的热解气相反应。
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