Analysis on the low current turn-on behavior of IGBT module

S. Momota, M. Otsuki, K. Ishii, H. Takubo, Y. Seki
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引用次数: 33

Abstract

This paper presents the noise emission mechanism from IGBT module, which is strongly required to be improved because of EMC regulations. The various 600 V/100 A IGBT module structures were experimentally and numerically tested to improve the current ringing during low current turn-on. As a result, it has been found that the parasitic inductance in the module should be as small as possible to suppress RLC resonant, which consists of parasitic components in the module and the capacitance in the power devices. It is also confirmed that the extra capacitance attached between gate-emitter of IGBT effectively improves the noise emission without increase the switching loss.
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IGBT模块小电流导通特性分析
本文介绍了IGBT模块的噪声发射机制,该机制由于EMC法规的要求而被强烈要求改进。对不同的600v / 100a IGBT模块结构进行了实验和数值测试,以改善小电流导通时的电流环。结果发现,要抑制RLC谐振,模块内的寄生电感应尽可能小,寄生电感由模块内的寄生元件和功率器件内的电容组成。在不增加开关损耗的情况下,在IGBT的栅极-发射极之间附加额外电容,有效地改善了噪声发射。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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