{"title":"Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device","authors":"J. Lau, C. Chang, R. Chen","doi":"10.1109/PEP.1997.656499","DOIUrl":null,"url":null,"abstract":"The curing conditions and material properties such as the coefficient of thermal expansion, glass transition temperature, Young's modulus, and moisture content of four different underfill encapsulants with different size and content of filler and epoxy are measured. The effects of these underfills on the flow rate, mechanical performance, and electrical performance of a solder-bumped functional flip chip on an organic substrate are studied.","PeriodicalId":340973,"journal":{"name":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PEP.1997.656499","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 17
Abstract
The curing conditions and material properties such as the coefficient of thermal expansion, glass transition temperature, Young's modulus, and moisture content of four different underfill encapsulants with different size and content of filler and epoxy are measured. The effects of these underfills on the flow rate, mechanical performance, and electrical performance of a solder-bumped functional flip chip on an organic substrate are studied.
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