Hybrid integrated silicon optical bench planar lightguide circuits

Abstract

As optical system architectures have matured over the past ten years, the use of silicon optical bench (SiOB) technology for cost effective packaging of opto-electronic components has migrated from relatively simple laser and photodetector submounts to sophisticated hybrid integrated optical subsystems. Lucent Technologies Bell Laboratories has been developing SiOB technology for use as an integrated packaging platform for lasers, photodetectors, waveguides and passive optical components. In this paper we describe two integrated optical sub-assemblies using planar lightguide circuits (PLCs) as examples of transceivers and complex laser source modules. The assemblies integrate lasers, photodetectors, passive waveguide splitters, wavelength division multiplex (WDM) filters, etched fiber and ball lens attachment sites, turning mirrors, optical reversing elements, deposited metals, solder dams and solders for mechanical and electrical contacts onto a single silicon optical sub-assembly. The approach allows for low cost batch processing, assembly and testing of complex components using the silicon wafer as a carrier and the use of automated pick-and-place machines for assembly.