Investigating the Mechanical Failures at the Bonded Joints of Screen-Printed E-Textile Circuits

Abstract

It is often necessary to connect e-textile devices with power supplies and other peripherals using electrical wires. This connection is usually achieved with the use of wires that are consequently bonded to the e-textile circuit using conductive epoxies or solders. This paper reports the mechanical failures that arise from this bonded joint during bending by considering the connection of textilebased Litz wires to screen-printed silver conductors using a combination of conductive epoxies and tapes as bonding adhesives. Cyclic bending results of the conductors around a 5 mm bending diameter rod show that conductors with bonded joints degrade after 3500 cycles with the formation of cracks and fractures around the bonded joints. Conductors without bonded joints achieve more than 10,000 bending cycles without the formation of cracks in the conductors.