J. Claßen, Florian Kult, Dusan Radovic, Thomas Zebrowski, A. Jemili, Andrea Visconti, C. Ezekwe, A. Buhmann, M. Dietrich, A. Grosse, R. Maul, Carsten Geckeler, R. Eid
{"title":"Evolution of Bosch Inertial Measurement Units for Consumer Electronics","authors":"J. Claßen, Florian Kult, Dusan Radovic, Thomas Zebrowski, A. Jemili, Andrea Visconti, C. Ezekwe, A. Buhmann, M. Dietrich, A. Grosse, R. Maul, Carsten Geckeler, R. Eid","doi":"10.1109/SENSORS47125.2020.9278815","DOIUrl":null,"url":null,"abstract":"MEMS based Inertial Measurement Units (IMUs) are being widely used in consumer electronic devices for a large variety of applications. We provide an overview of three generations of IMUs developed at Bosch in the past years. Significant progress of design and technology has been made in electronics, micromechanics, and system integration. We discuss some of the technical challenges and achievements leading to improvements in key parameters like package size, power consumption, and performance.","PeriodicalId":338240,"journal":{"name":"2020 IEEE Sensors","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Sensors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SENSORS47125.2020.9278815","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
MEMS based Inertial Measurement Units (IMUs) are being widely used in consumer electronic devices for a large variety of applications. We provide an overview of three generations of IMUs developed at Bosch in the past years. Significant progress of design and technology has been made in electronics, micromechanics, and system integration. We discuss some of the technical challenges and achievements leading to improvements in key parameters like package size, power consumption, and performance.
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