A new method for equivalent acceleration of JEDEC moisture sensitivity levels

D. Shi, Xuejun Fan, B. Xie
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引用次数: 8

Abstract

In order to devise an equivalent accelerated moisture sensitivity test, the JEDEC specification J-STD-020C has recommended an accelerated preconditioning time of 40 hrs exposure under 60degC / 60% RH, which is considered equivalent to the standard moisture sensitivity level 3 (MSL-3) of 216 hrs soak time under 30degC / 60% RH. However, the existing methodology for the accelerated moisture sensitivity test was developed based on the equivalency of local moisture concentration at the interest of location for leaded packages only. The failure mechanism is restricted to the potential delamination between mold compound and leadframe. In addition, such an equivalency requires the activation energy of molding compound for moisture diffusion in the range of 0.4 - 0.48 eV. This paper introduces a new method to accelerate JEDEC/IPC moisture sensitivity level testing. The methodology is developed based on the equivalency of both local moisture concentration and overall moisture distribution of packages. The local moisture concentration equivalency ensures identical adhesion strength and vapor pressure at interfaces of the interest, and the overall moisture distribution equivalency results in the same condition of applied driving forces, such as thermal and hygroscopic stresses, during reflow. In our previous study (Xie et al., 2007), this methodology was applied to a molded matrix array package, and an accelerated soak time subjected to 60degC / 60% RH was established. In this paper, the further reduction of soak time using 85degC / 60% RH is investigated. An ultra-thin stacked-die chip scale package (CSP) is used as the test vehicle. Extensive experiments have been carried out to obtain the failure rate as function of soak time under various environmental conditions. Finite element analysis was performed to obtain the equivalency conditions. According to finite element modeling results, it has been found that, at 70hrs under 60degC / 60% RH and 45 hrs under 85degC / 60% RH, respectively, both the local moisture concentration at critical interface and overall moisture distribution of package become identical to that under the standard MSL-3. Such an equivalency of the new accelerated test conditions has been proven by the test results. Failure site and failure mode indicates that the proposed accelerated tests are well correlated with the standard MSL-3. The new methodology can be extended to other packages.
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JEDEC水分敏感水平等效加速度的新方法
为了设计等效的加速湿气敏感性测试,JEDEC规范J-STD-020C建议在60℃/ 60% RH下加速预处理40小时,这被认为相当于标准湿气敏感性等级3 (MSL-3)在30℃/ 60% RH下浸泡216小时。然而,现有的加速湿气敏感性试验方法是基于当地湿气浓度的等效性而开发的,仅适用于含铅包装。失效机制仅限于模具复合材料与引线框架之间的潜在分层。此外,这种等效要求成型化合物的水分扩散活化能在0.4 - 0.48 eV范围内。介绍了一种加速JEDEC/IPC湿敏等级测试的新方法。该方法是基于包装的局部水分浓度和整体水分分布的等效性而开发的。局部水分浓度等效确保了目标界面上相同的附着强度和蒸汽压,而整体水分分布等效导致了回流过程中施加的驱动力(如热应力和吸湿应力)相同的条件。在我们之前的研究中(Xie et al., 2007),将该方法应用于模制矩阵阵列封装,并建立了60℃/ 60% RH下的加速浸泡时间。本文研究了在85℃/ 60% RH条件下进一步缩短浸泡时间的方法。采用超薄叠层芯片级封装(CSP)作为测试载体。在不同的环境条件下,进行了大量的试验,得到了失效率与浸泡时间的关系。通过有限元分析得到了等效条件。根据有限元模拟结果发现,在60℃/ 60% RH条件下的70h和85℃/ 60% RH条件下的45h下,临界界面局部水分浓度和包体整体水分分布都与标准MSL-3条件下相同。试验结果证明了新加速试验条件的等效性。失效地点和失效模式表明,所提出的加速试验与标准MSL-3具有良好的相关性。新的方法可以扩展到其他软件包。
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