Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying

M. Saito, J. Mizuno, Shunichi Koga, H. Nishikawa
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引用次数: 1

Abstract

We investigated the composition, morphology, and dissolution behavior of an Au-Ag nanoporous structure formed by electrodeposition and dealloying. Formation of the films was carried out by changing the bath composition and the annealing temperature. The amount of Ag decreased from 70 wt. % to 45–50 wt. % after dealloying. As seen from analysis by a glow discharge optical emission spectrometer (GDOES), not only the amount of Ag, but also that of Au was decreased after dealloying, and a highly concentrated Ag layer was generated at the surface. When the Ag dissolves, an underpotential deposition (UPD) might be introduced, followed by the generation of a high concentration of Ag. From the anodic polarization measurement, the anodic current densities of the samples under 1.5 V were larger than those of the samples under 1.0 V, resulting in the generation of many nanopores. It was confirmed that dealloying involved three processes: whole film dissolution (includes Au dissolution), defects dissolution at the grain boundary, and Ag-selective dissolution.
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电沉积和合金化控制Au-Ag纳米孔结构
我们研究了电沉积和合金化形成的Au-Ag纳米孔结构的组成、形貌和溶解行为。通过改变镀液成分和退火温度,实现了薄膜的形成。合金化后,银含量从70 wt. %下降到45 ~ 50 wt. %。通过辉光发射光谱仪(GDOES)分析,合金除银的含量减少外,金的含量也减少,表面形成了一层高浓度的银层。当银溶解时,可能会引入欠电位沉积(UPD),随后会产生高浓度的银。从阳极极化测量来看,1.5 V下样品的阳极电流密度大于1.0 V下样品的阳极电流密度,导致产生许多纳米孔。结果表明,合金的溶出过程包括三个过程:全膜溶出(包括Au溶出)、晶界缺陷溶出和ag选择性溶出。
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