Minimizing Form Factor and Parasitic Inductances of Power Electronic Modules: The p2 Pack Technology

Abstract

Hybrid and electrical Drive is bringing momentum to the development of new solutions for high power drives, DC/DC and AC/DC converters. High power means increased challenges for high current and for thermal management of dissipated power as well. The p2 Pack Technology is a real alternative to conventional systems to further improve reliability, power dissipation at lower system complexity and lower cost. It also meets the challenge of minimized installation space due to its low volume. It could be shown that inductances of the switching cells can be less than 1nH. Therefore all application with the need for fast switching, especially wideband gap semiconductors like GaN and SiC can profit from this embedding architecture. With the new p2 Pack Technology a new architecture was developed, which is helpful for very robust, cost efficient and miniaturized high power Inverter configurations.