{"title":"Thermal phenomena during the encapsulation of electronic devices","authors":"J. Emerson","doi":"10.1109/ITHERM.1988.28701","DOIUrl":null,"url":null,"abstract":"Difficulties resulting from plastic encapsulation for large semiconductor chips, electronic modules such as ceramic hybrid circuits, and passive components are classified into three problem areas. These are temperature excursion, moisture, and electrical. The failure related to each item is listed. A review of thermally reduced failures of encapsulated devices, and assembly sequences and testing are discussed for a broad range of applications.<<ETX>>","PeriodicalId":226424,"journal":{"name":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.1988.28701","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Difficulties resulting from plastic encapsulation for large semiconductor chips, electronic modules such as ceramic hybrid circuits, and passive components are classified into three problem areas. These are temperature excursion, moisture, and electrical. The failure related to each item is listed. A review of thermally reduced failures of encapsulated devices, and assembly sequences and testing are discussed for a broad range of applications.<>
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