Development of back junction point contact photovoltaic cells and arrays for space

V. Garboushian, G. Turner, S. Yoon, G. Vendura
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引用次数: 4

Abstract

This paper presents the results of a project to develop back-junction, point-contact silicon solar cells and modules for space. Such cells are already fabricated commercially for terrestrial applications using standardized equipment and processes originally developed for high manufacturing throughput, low-cost semiconductor chip technologies. Individual 2 cm/spl times/2 cm cell outputs of 18%, AM0 are routinely obtained. Since all contacting takes place at the back surface, very high packing densities are possible resulting in comparatively higher output for arrays. The present study is divided into three phases: (1) development of individual cells into a space product, (2) development of rigid and flexible modules (3) and module fabrication for flight experimentation upon the Small Satellite Technology Initiative (SSTI). The first phase focused upon silicon surface and bulk features to increase photon absorption and reduce recombination. The compatibility of the finished cells with space worthy components such as interconnects and coverglasses was confirmed. In the next phase, cells were assembled into small modules. Substrate material included both rigid, 8 mil, silicon wafers as well as flexible, 1 mil Kapton. An interconnection system was developed which consisted of redundant thin-film metal patterns deposited directly on the substrate surfaces. This was followed by a solder reflow bonding process compatible with high volume robotic fabrication equipment. This effort resulted in the fabrication and testing of two SSTI flight modules consisting of a series arrangement of nine 2 cm/spl times/2 cm cells each.
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用于空间的后接点接触光伏电池和阵列的发展
本文介绍了一个开发用于空间的后结点接触硅太阳能电池和组件的项目的结果。这种电池已经商业化,用于地面应用,使用标准化的设备和工艺,最初是为高制造吞吐量、低成本的半导体芯片技术而开发的。单个2cm /spl倍/ 2cm细胞输出18%,常规得到AM0。由于所有接触都发生在背面,因此非常高的填充密度可能导致阵列相对较高的输出。目前的研究分为三个阶段:(1)将单个单元开发为空间产品,(2)开发刚性和柔性模块,(3)以及根据小卫星技术倡议(SSTI)进行飞行实验的模块制造。第一阶段的重点是硅表面和体特征,以增加光子吸收和减少复合。成品电池与有空间价值的组件(如互连和覆盖玻璃)的兼容性得到了证实。在下一阶段,细胞被组装成小模块。衬底材料包括刚性的8mil硅片和柔性的1mil卡普顿硅片。开发了一种由直接沉积在衬底表面的冗余薄膜金属图案组成的互连系统。随后是与大批量机器人制造设备兼容的焊料回流焊工艺。这一努力导致了两个SSTI飞行模块的制造和测试,该模块由9个2厘米/ 1倍/2厘米单元组成。
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