Design of Micro-channel Cooling Structures For a Ku-band Sheet Beam Travelling Wave Tube

Abstract

Micro-channel heat transfer has a superior power capacity and heat dissipation handling ability compared with the traditional cooling topology due to its advantages of compact dimensions and effective heating transferring ability. This leads to many potential applications for the high power millimeter wave and THz vacuum electron devices with high power density loss and limited size. In this paper, thermal analysis of a optimized high efficient cooling structure considering the dielectric attenuated losses and electrons interception were studied for a Ku-band continous wave sheet beam travelling wave tube. Results shows the RF circuit with micro-channel structure can operate with maximum ~1kW dielectric loss power and maximum 7% electrons interception.