Highly thermal conductive transparent die attach material for LEDs

Abstract

Transparent die attach materials (DA) with moderate thermal conductivity without yellowing are preferred for mid-power LEDs, which dominate the LED backlighting and general solid-state lighting markets. A novel DA was developed based on a new kind of silicone base material specifically designed and synthesized. Compared with widely used transparent DA of KER-3000-M2 from Shin-Etsu Chemical Co., Ltd., the newly developed DA has high thermal conductivity of 0.53 W/m-K, low viscosity of 7 Pa-s at 1 s-1, and a transmittance of 97% at wavelength of 450 nm without trading off the good adhesion. Packaged in 0.3 W blue LEDs, the new DA helps achieve around 26% thermal resistance reduction and 7.7% radiometric power improvement.