New decapsulation methods for ICs with Cu and Ag wires

Abstract

Introduction of Cu and more recently of Ag wires in integrated circuits made the decapsulation more challenging for failure analysts. We made an experiment with the existing techniques we study in the past years and a comparison with the results and the emerging techniques from the last researchs. This study shows that solution has been demonstrated but there is still a place for improvement if we want to have a robust process for all types of ICs.