Study of 25nm Symmetric Extended Source/Drain Schottky Tunneling Transistors

J. Ajayan, T. Subash, T. Gnanasekaran, N. Kumar
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Abstract

The performance of 25nm Symmetric Extended Source/Drain Schottky Tunneling Transistor (ESD-ST-SOIFET) with different gate structures are investigated through a TCAD modeling study. It is shown that, the doped extension regions adjacent to the source/drain schottky barrier improves the drive current by shrinking the schottky barrier and also the simulation results shows that the increasing doping levels at the source/drain(S/D) extensions increases the leakage current. The device shows better short channel effects compared to other schottky barrier devices. The analysis also shows that, the best characteristics of the proposed device can be obtained only if using proper silicides at the S/D regions. For best performance platinum silicide can be used for p-type and Erbium silicide can be used for n-type devices.
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25nm对称扩展源漏肖特基隧道晶体管的研究
通过TCAD建模研究了具有不同栅极结构的25nm对称扩展源漏肖特基隧道晶体管(ESD-ST-SOIFET)的性能。结果表明,在源/漏极肖特基势垒附近的掺杂延伸区通过缩小肖特基势垒提高了驱动电流,并且仿真结果表明,在源/漏极(S/D)延伸处掺杂水平的增加增加了泄漏电流。与其它肖特基势垒器件相比,该器件具有较好的短通道效应。分析还表明,只有在S/D区使用适当的硅化物才能获得最佳的器件特性。为了获得最佳性能,硅化铂可用于p型器件,硅化铒可用于n型器件。
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