The fabrication of high frequency fundamental crystals by plasma etching

F. Stern, J. Dowsett, D. Carter, R. Williamson
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引用次数: 9

Abstract

A method is described for manufacturing AT-cut high-frequency-fundamental crystals up to 150 MHz. Individual samples at fundamental frequencies up to 500 MHz have also been fabricated, demonstrating that batch production of crystals with very high fundamental frequencies is also feasible. Plasma etching is used for recessing blanks to the desired thickness. High-quality quartz is essential as the starting material and careful preparation of the blanks prior to plasma etching is required. Examples of electrical parameter measurements on production batches of crystals at fundamental frequencies between 60 MHz and 150 MHz are given, together with results from sample crystals at frequencies up to 500 MHz.<>
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等离子体蚀刻制备高频基态晶体
描述了一种制造高达150 MHz的at切割高频基频晶体的方法。基频高达500 MHz的单个样品也被制造出来,这表明具有非常高基频的晶体的批量生产也是可行的。等离子蚀刻用于将毛坯凹进到所需的厚度。高质量的石英是必不可少的起始材料,在等离子蚀刻之前需要仔细准备毛坯。给出了在60 MHz和150 MHz基频范围内对晶体生产批次进行电参数测量的例子,以及频率高达500 MHz的样品晶体的结果
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