S. Clemens, Edmond Chong, M. Iskander, Z. Yun, Joseph Brown, T. Ray, Matthew Nakamura, Deylen Nekoba
{"title":"Hybrid Genetic Programming Designed Laser-Induced Graphene Based Absorber","authors":"S. Clemens, Edmond Chong, M. Iskander, Z. Yun, Joseph Brown, T. Ray, Matthew Nakamura, Deylen Nekoba","doi":"10.1109/AP-S/USNC-URSI47032.2022.9887152","DOIUrl":null,"url":null,"abstract":"Hybrid genetic programming (HGP) is applied to the design and optimization of a laser-induced graphene (LIG) based metasurface (MS) electromagnetic absorber. The HGP designed absorber has bandwidths of 115.4%and 56.5% for absorptivity above 70% and 80%, respectively. It is 5.1 mm thick, with a unit cell (UC) periodicity of 8.7 mm. The LIG is generated on a polyimide substrate. The MS absorber has copper ground plane backing.","PeriodicalId":371560,"journal":{"name":"2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/AP-S/USNC-URSI47032.2022.9887152","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Hybrid genetic programming (HGP) is applied to the design and optimization of a laser-induced graphene (LIG) based metasurface (MS) electromagnetic absorber. The HGP designed absorber has bandwidths of 115.4%and 56.5% for absorptivity above 70% and 80%, respectively. It is 5.1 mm thick, with a unit cell (UC) periodicity of 8.7 mm. The LIG is generated on a polyimide substrate. The MS absorber has copper ground plane backing.