Reduction of ohmic loss in planar circuits and antennas using laminated conductors

Abstract

Modifying a solid conductor with multiple thin laminated conductors can significantly reduce the ohmic loss of microstrip conductors. This concept can be used in circuits and antennas where substantial conductor loss occurs. The lamination in the composite material is realized using dielectric material. The laminating dielectric thickness is smaller or of the order of the skin depth of the conductor. First, it is shown analytically that in this composite material, the power lost is less in the conductor with several laminated conductors instead of a single solid conductor having the same thickness. The concept can be used in miniaturized antennas having poor gain due to a very high ohmic loss to improve their gain and efficiency by reducing the loss using multiple laminated conductors.