Optical micro sensors integration and application

Abstract

Integrating and miniaturizing optical equipment confers many advantages: low weight, low power consumption, portability, and ease to embed. However, integration and miniaturization presents difficulties because optical elements in the equipment need precise alignment and packaging. We have previously developed several types of optical micro-sensors, including micro-electromechanical systems (MEMS) blood flow sensors, micro-optical encoders, and a micro-laser Doppler velocimeter. Cavities containing empty space and mirrors, through-silicon vias, and three-dimensional electrodes enable our sensors achieve wafer-level packaging of the optical MEMS chip. We introduce the integration of our developed miniaturized optical sensors and several applications.