Development of Cu-Zn-Al based shape memory alloy

M. I. Dawson, S. Batool, Raheel Nadeem
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引用次数: 1

Abstract

Shape Memory Alloys (SMA) has intriguing attributes of recovering apparent permanent deformations to about 10% and above. In addition, these are metal alloys and display typical features of metals like resistance, stiffness, and workability etc. The blend of all these properties makes it easy to know why these materials are smart in the grounds of engineering and ascend to a new way of thoughts about the design of mechanical systems. The present study aims to develop Cu-Zn-Al based shape memory alloy by melting route, finding out the transformation temperatures and the development of shape memory effect. The design and methodology approach includes the mixture of test material which is chips of pure Copper (99.9%), Zinc (99%) and Aluminum (85%). All these chips are mixed and melted. Furthermore, the melt was die casted in open air in a capsule shape. X-ray fluorescence (XRF) was carried out to check the estimated composition and afterwards spectroscopy was done to check the actual composition of the alloy. In addition, the alloy, in a capsule form, was cold rolled up to 1 mm thickness with inter pass annealing at 350°C to form a wire. After that the thermal properties of the wire were examined by a custom made experiment following the principles of Differential Scanning Calorimeter (DSC). The final wire was then heat treated 830C° for 18 minutes followed by step quenching and then aging at 150C° for 90 minutes followed by quenching to induce the shape memory effect (SME) in the alloy.
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Cu-Zn-Al基形状记忆合金的研制
形状记忆合金(SMA)具有将表观永久变形恢复到10%及以上的有趣特性。此外,这些都是金属合金,具有金属的典型特征,如电阻、刚度和可加工性等。所有这些特性的融合使我们很容易了解为什么这些材料在工程领域是聪明的,并提升到机械系统设计的新思路。本研究旨在通过熔融法制备Cu-Zn-Al基形状记忆合金,研究其相变温度和形状记忆效应的发展。设计和方法方法包括测试材料的混合物,即纯铜(99.9%),锌(99%)和铝(85%)的芯片。所有这些薯片都是混合融化的。此外,熔体在露天压铸成胶囊形状。用x射线荧光(XRF)检查预估成分,然后用光谱学检查合金的实际成分。此外,将胶囊状合金冷轧至1mm厚,并在350℃下进行道间退火以形成线材。然后,根据差示扫描量热计(DSC)的原理,通过定制的实验来检测金属丝的热性能。然后将最终钢丝在830C°热处理18分钟后逐步淬火,然后在150C°时效90分钟后淬火,以诱导合金的形状记忆效应(SME)。
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