Integrated Multi-Level CMOS Electrostatic Discharge (MLC-ESD) Protection Medical Ultrasound Chip System

J. Liou, Wen-De Lin
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Abstract

This paper describes the advantages of integrating a common Power Clamp with the ability to withstand voltage and save on wafer area. The system chip does not require a power clamp for each input source. It is as long as the system core circuit by electrostatic protection. It can reach normal operation and save as much chip area as possible. The structure of this paper has three main features: (1) electrostatic protection (ESD) circuit common Power Clamp combination (2) T025 process high and low voltage ESD (3) The experiment and results within ESD system. The results of ESD sensitivity passed is -6250V~+6200V for type HBM mode. It is -375V~+375V for type MM mode.
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集成多级CMOS静电放电(MLC-ESD)保护医用超声芯片系统
本文介绍了将普通电源钳与耐电压和节省晶圆面积的能力集成在一起的优点。系统芯片不需要每个输入源的电源钳。只要系统的核心电路受到静电保护。既能达到正常运行,又能尽可能地节省芯片面积。本论文的结构主要有三个特点:(1)静电保护(ESD)电路常见的Power Clamp组合;(2)T025工艺的高低压ESD; (3) ESD系统内的实验和结果。HBM模式下,通过的ESD灵敏度为-6250V~+6200V。MM型为-375V~+375V。
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