{"title":"On package modelling","authors":"J. Ladvánszky","doi":"10.1109/EUMA.1994.337453","DOIUrl":null,"url":null,"abstract":"Our purpose is twofold: to compare two frequently used circuits modelling MESFET and HEMT packages, and to outline a novel task description for optimizing circuit elements of the package model.","PeriodicalId":440371,"journal":{"name":"1994 24th European Microwave Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 24th European Microwave Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUMA.1994.337453","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Our purpose is twofold: to compare two frequently used circuits modelling MESFET and HEMT packages, and to outline a novel task description for optimizing circuit elements of the package model.
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