{"title":"Opportunities and design considerations of GaN HEMTs in ZVS applications","authors":"Juncheng Lu, Ruoyu Hou, Di Chen","doi":"10.1109/APEC.2018.8341117","DOIUrl":null,"url":null,"abstract":"Gallium Nitride enhancement-mode high electron mobility transistors (GaN E-HEMTs) exhibit superior performance versus Si devices in both hard-switching and soft-switching converters. Due to the relatively higher switching-on loss compared with switching-off loss, zero voltage switching (ZVS) turn-on is still preferred to the application scope which efficiency is the primary design target. In this paper, the characteristics of GaN HEMTs under ZVS conditions is modeled. The packaging considerations on circuit parasitics and thermal management for soft switching applications is also discussed. An insulated metal substrate (IMS) based half-bridge power module consisting of two high-side and two low-side 650 V/60 A GaN HEMTs in parallel is designed and experimentally evaluated. A strong correlation is shown between simulations and experiments, verifying the power module design and GaN HEMTs' loss model.","PeriodicalId":113756,"journal":{"name":"2018 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"23","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC.2018.8341117","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 23
Abstract
Gallium Nitride enhancement-mode high electron mobility transistors (GaN E-HEMTs) exhibit superior performance versus Si devices in both hard-switching and soft-switching converters. Due to the relatively higher switching-on loss compared with switching-off loss, zero voltage switching (ZVS) turn-on is still preferred to the application scope which efficiency is the primary design target. In this paper, the characteristics of GaN HEMTs under ZVS conditions is modeled. The packaging considerations on circuit parasitics and thermal management for soft switching applications is also discussed. An insulated metal substrate (IMS) based half-bridge power module consisting of two high-side and two low-side 650 V/60 A GaN HEMTs in parallel is designed and experimentally evaluated. A strong correlation is shown between simulations and experiments, verifying the power module design and GaN HEMTs' loss model.
氮化镓增强型高电子迁移率晶体管(GaN e - hemt)在硬开关和软开关变换器中都表现出优于Si器件的性能。由于零电压开关(zero voltage switching, ZVS)的导通损耗相对于关断损耗相对较高,因此在以效率为主要设计目标的应用范围中,仍优先考虑零电压开关导通。本文建立了ZVS条件下GaN hemt的特性模型。讨论了软开关应用中电路寄生和热管理方面的封装考虑。设计了一种基于绝缘金属基板(IMS)的半桥功率模块,该模块由两个高侧和两个低侧650v / 60a GaN hemt并联组成。仿真结果与实验结果具有较强的相关性,验证了功率模块设计和GaN hemt的损耗模型。